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Package Architect

Intel Corp.

This is a Full-time position in Hillsboro, OR posted December 5, 2020.

Package ArchitectJob DescriptionIntel is seeking to hire a Microelectronic, (SoC), Packaging Engineer/Architect to provide package architecture, design, development and project management support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.

Responsible for the electrical design, analysis, and development of SoC packages while collaborating with thermal/mechanical and manufacturing stakeholders.

Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design.

Provides consultation concerning packaging problems and improvements in the packaging process.

Responds to customer/client requests or events as they occur.

Develops solutions to problems utilizing formal education and judgment.

Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.QualificationsYou must possess the minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications: Bachelor’s Degree or higher in Electrical Engineering 5+ years of Industry experience 3+ years of experience in SoC development as a technical contributor 1+ years of Silicon floor planning and development experience Preferred Qualifications: 5+ years of SOC experience 3+ years of Silicon Packaging Architecture experience as a technical contributor 3+ years of Silicon floor planning and development experienceInside this Business GroupThe Client Computing Group is responsible for all aspects of the client computing business across Phone, Phablet, Tablet and PC platforms, leading Intel’s efforts to transform client computing through technologies, new form factors, and driving Intel’s corporate-wide user experience initiatives.

This spans all client device brands including hardware, software and connectivity ingredients for phones, tablets, Ultrabook™, All-in-Ones, 2 in 1 computing devices, and home gateways.Other LocationsUS, California, Santa ClaraPosting StatementAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.USExperienced HireJR0148110Hillsboro

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